INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, 東京エレクトロン株式会社 FILES APPLICATION FOR "PROCESSING LIQUID SUPPLY DEVICE AND PROCESSING LIQUID SUPPLY METHOD"

Posted On: 2025-07-08

GENEVA, July 8 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku, Tokyo1076325), 東京エレクトロン株式会社 (東&#201... Read More

INTERNATIONAL PATENT: TOPPAN HOLDINGS INC., ＴＯＰＰＡＮホールディングス株式会社 FILES APPLICATION FOR "MULTILAYER WIRING BOARD, METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD AND MULTILAYER WIRING BASE BOARD"

Posted On: 2025-07-08

Government News US Fed News

GENEVA, July 8 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), ＴＯＰＰＡＮホールディングス&#2... Read More

INTERNATIONAL PATENT: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., パナソニックＩＰマネジメント株式会社 FILES APPLICATION FOR "PROJECTION DEVICE, PROJECTION SYSTEM AND PROJECTION METHOD"

Posted On: 2025-07-08

Government News US Fed News

GENEVA, July 8 -- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (22-6, Moto-machi, Kadoma-shi, Osaka5710057), パナソニックＩＰマネ&#1... Read More

INTERNATIONAL PATENT: CEMEDINE CO., LTD., セメダイン株式会社 FILES APPLICATION FOR "STRUCTURAL ADHESIVE APPLICATION THICKNESS ADJUSTMENT METHOD, APPLICATION THICKNESS ADJUSTMENT JOINT MEMBER AND APPLICATION THICKNESS ADJUSTMENT STRUCTURE"

Posted On: 2025-07-08

Government News US Fed News

GENEVA, July 8 -- CEMEDINE CO., LTD. (1-11-2, Osaki, Shinagawa-ku, Tokyo1418620), セメダイン株式会社 (東京都品川&#21... Read More

INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, 東京エレクトロン株式会社 FILES APPLICATION FOR "METHOD FOR FORMING RESIST PATTERN AND PROCESSING DEVICE"

Posted On: 2025-07-08

Government News US Fed News

GENEVA, July 8 -- TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku, Tokyo1076325), 東京エレクトロン株式会社 (東&#201... Read More

INTERNATIONAL PATENT: SHISEIDO COMPANY, LTD., 株式会社資生堂 FILES APPLICATION FOR "DOUBLE CONTAINER, REFILL CONTAINER AND METHOD FOR MANUFACTURING REFILL CONTAINER"

Posted On: 2025-07-08

Government News US Fed News

GENEVA, July 8 -- SHISEIDO COMPANY, LTD. (5-5, Ginza 7-chome, Chuo-ku, Tokyo1040061), 株式会社資生堂 (東京都中央区銀... Read More

INTERNATIONAL PATENT: MORISHITA JINTAN CO., LTD., 森下仁丹株式会社 FILES APPLICATION FOR "METHOD FOR STABLY PRODUCING SEAMLESS CAPSULES"

Posted On: 2025-07-08

Government News US Fed News

GENEVA, July 8 -- MORISHITA JINTAN CO., LTD. (2-40, Tamatsukuri 1-chome, Chuo-ku, Osaka-shi, Osaka5408566), 森下仁丹株式会社 (大阪府&#... Read More

INTERNATIONAL PATENT: SHISEIDO COMPANY, LTD., 株式会社　資生堂, TOHOKU UNIVERSITY, 国立大学法人東北大学 FILES APPLICATION FOR "METHOD FOR PREDICTING ATOPIC DERMATITIS"

Posted On: 2025-07-08

Government News US Fed News

GENEVA, July 8 -- SHISEIDO COMPANY, LTD. (5-5, Ginza 7-chome, Chuo-ku, Tokyo1040061), 株式会社　資生堂 (東京都中央区... Read More

INTERNATIONAL PATENT: HAMAMATSU PHOTONICS K.K., 浜松ホトニクス株式会社, NATIONAL INSTITUTES FOR QUANTUM SCIENCE AND TECHNOLOGY, 国立研究開発法人量子科学技術研究開発機構 FILES APPLICATION FOR "IMAGE PROCESSING DEVICE AND IMAGE PROCESSING METHOD"

Posted On: 2025-07-08

Government News US Fed News

GENEVA, July 8 -- HAMAMATSU PHOTONICS K.K. (1126-1, Ichino-cho, Chuo-ku, Hamamatsu-shi, Shizuoka4358558), 浜松ホトニクス株式会社 (&#38... Read More

INTERNATIONAL PATENT: SONY GROUP CORPORATION, ソニーグループ株式会社 FILES APPLICATION FOR "BIOLOGICAL PARTICLE ANALYSIS SYSTEM, INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD"

Posted On: 2025-07-08

Government News US Fed News

GENEVA, July 8 -- SONY GROUP CORPORATION (1-7-1, Konan, Minato-ku, Tokyo1080075), ソニーグループ株式会社 (東京都&#28... Read More

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INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, 東京エレクトロン株式会社 FILES APPLICATION FOR "PROCESSING LIQUID SUPPLY DEVICE AND PROCESSING LIQUID SUPPLY METHOD"

INTERNATIONAL PATENT: TOPPAN HOLDINGS INC., ＴＯＰＰＡＮホールディングス株式会社 FILES APPLICATION FOR "MULTILAYER WIRING BOARD, METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD AND MULTILAYER WIRING BASE BOARD"

INTERNATIONAL PATENT: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., パナソニックＩＰマネジメント株式会社 FILES APPLICATION FOR "PROJECTION DEVICE, PROJECTION SYSTEM AND PROJECTION METHOD"

INTERNATIONAL PATENT: CEMEDINE CO., LTD., セメダイン株式会社 FILES APPLICATION FOR "STRUCTURAL ADHESIVE APPLICATION THICKNESS ADJUSTMENT METHOD, APPLICATION THICKNESS ADJUSTMENT JOINT MEMBER AND APPLICATION THICKNESS ADJUSTMENT STRUCTURE"

INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, 東京エレクトロン株式会社 FILES APPLICATION FOR "METHOD FOR FORMING RESIST PATTERN AND PROCESSING DEVICE"

INTERNATIONAL PATENT: SHISEIDO COMPANY, LTD., 株式会社資生堂 FILES APPLICATION FOR "DOUBLE CONTAINER, REFILL CONTAINER AND METHOD FOR MANUFACTURING REFILL CONTAINER"

INTERNATIONAL PATENT: MORISHITA JINTAN CO., LTD., 森下仁丹株式会社 FILES APPLICATION FOR "METHOD FOR STABLY PRODUCING SEAMLESS CAPSULES"

INTERNATIONAL PATENT: SHISEIDO COMPANY, LTD., 株式会社　資生堂, TOHOKU UNIVERSITY, 国立大学法人東北大学 FILES APPLICATION FOR "METHOD FOR PREDICTING ATOPIC DERMATITIS"

INTERNATIONAL PATENT: HAMAMATSU PHOTONICS K.K., 浜松ホトニクス株式会社, NATIONAL INSTITUTES FOR QUANTUM SCIENCE AND TECHNOLOGY, 国立研究開発法人量子科学技術研究開発機構 FILES APPLICATION FOR "IMAGE PROCESSING DEVICE AND IMAGE PROCESSING METHOD"

INTERNATIONAL PATENT: SONY GROUP CORPORATION, ソニーグループ株式会社 FILES APPLICATION FOR "BIOLOGICAL PARTICLE ANALYSIS SYSTEM, INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD"